A. a linear organopolysiloxane having two alkenyl groups per molecule;

B. a linear organohydrogenpolysiloxane having two Si—H groups per molecule, the Si—H groups being present at both ends of a molecular chain;

C. an organohydrogenpolysiloxane having three or more Si—H groups per molecule;

D. a linear organohydrogenpolysiloxane having one Si—H group per molecule;

E. a platinum catalyst in an amount required for curing; and

F. a thermally conductive filler, a volume occupied by the thermally conductive filler being 1 to 6 times a volume occupied by the components A to E,

wherein the components A to F are cured,

wherein the thermally conductive silicone gel composition comprises 1 to 300 parts by weight of the component B, 0.1 to 20 parts by weight of the component C, and 0.1 to 50 parts by weight of the component D with respect to 100 parts by weight of the component A, wherein a ratio of the Si—H group to the alkenyl group (Si—H group/alkenyl group) in all the components A to D is 0.5 to 2.0, and

wherein an oil bleeding rate of the thermally conductive silicone gel composition is 0.45 wt % or less, which is calculated according to the following Formula I and measured in such a manner that the thermally conductive silicone gel composition is formed into a molded product with a width of 25 mm, a length of 25 mm, and a thickness of 3.0 mm, and then the molded product is sandwiched between polytetrafluoroethylene (PTFE) filter papers, compressed to a thickness of 1.8 mm, and allowed to stand for 24 hours in an atmosphere of 80° C.,