	US 12,152,140 B2
	Conductive resin composition, resin molded body, and article
Takahiro Kojima, Kanagawa (JP); and Akira Yane, Tokyo (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Feb. 17, 2021, as Appl. No. 17/177,728.
Claims priority of application No. 2020-028011 (JP), filed on Feb. 21, 2020; and application No. 2020-212460 (JP), filed on Dec. 22, 2020.
Prior Publication US 2021/0261767 A1, Aug. 26, 2021
Int. Cl. C08L 59/02 (2006.01); C08K 3/04 (2006.01); C08K 5/353 (2006.01)

CPC C08L 59/02 (2013.01) [C08K 3/04 (2013.01); C08K 5/353 (2013.01); C08K 2201/001 (2013.01)]

20 Claims

1. A conductive resin composition comprising:

a polyacetal;

conductive carbon black which has an organic functional group having acid active hydrogen;

graphite; and

an oxazoline group-containing compound and a reaction product thereof,

wherein a content of the polyacetal is 50 mass % or more,

wherein the oxazoline group-containing compound is an oxazoline derivative represented by the following formula (2) or (3)

and

wherein in the formula (3), m and n each represents an integer, and

wherein a total stoichiometric amount of the oxazoline group-containing compound and the reaction product thereof is 0.02 mmol or more and 2 mmol or less with respect to 1 g of the carbon black.