| CPC B23K 26/38 (2013.01) [B23K 26/0622 (2015.10); B23K 26/0648 (2013.01); B23K 26/082 (2015.10); B23K 2103/42 (2018.08); G02B 5/30 (2013.01)] | 5 Claims |
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1. A method of cutting a polarizing plate comprising a stacking of a base substrate and a polarizing layer, the method comprising:
irradiating a first laser beam having a first optical power in a direction from the base substrate to the polarizing layer to cut the base substrate; and
cutting the polarizing layer by irradiating a second laser beam having a second optical power in the direction after the base substrate is cut, the second optical power being less than the first optical power,
wherein a heat resistance of the base substrate is higher than that of the polarizing layer,
wherein the method is performed by a polarizing plate-cutting device comprising:
a laser beam generator configured to sequentially emit the first and the second laser beam;
a scanner comprising a rotating mirror configured to reflect the first and second laser beams emitted from the laser beam generator, and a housing accommodating the rotating mirror;
a condenser lens configured to condense the first and second laser beams reflected from the rotating mirror; and
a mounting block onto which the first and second laser beams condensed by the condenser lens are irradiated and to which a polarizing plate is mounted,
wherein the mounting block is fixed with respect to the scanner while the polarizing plate is being cut, and
wherein an intensity of the first optical power is 15 J/cm2 to 20 J/cm2 and an intensity of the second optical power is 3 J/cm2 to about 7 J/cm2.
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