US 12,151,312 B2
Laser processing apparatus
Hiroshi Morikazu, Tokyo (JP); and Nobuyuki Kimura, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Mar. 16, 2023, as Appl. No. 18/184,973.
Application 18/184,973 is a division of application No. 17/199,759, filed on Mar. 12, 2021, abandoned.
Claims priority of application No. 2020-059800 (JP), filed on Mar. 30, 2020.
Prior Publication US 2023/0219169 A1, Jul. 13, 2023
Int. Cl. B23K 26/364 (2014.01); B23K 26/06 (2014.01); B23K 26/073 (2006.01); B23K 26/082 (2014.01); B23K 26/359 (2014.01); B23K 26/402 (2014.01); B23K 103/00 (2006.01); B32B 7/12 (2006.01); B32B 9/04 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); B32B 43/00 (2006.01); H01L 33/00 (2010.01)
CPC B23K 26/364 (2015.10) [B23K 26/0665 (2013.01); B23K 26/073 (2013.01); B23K 26/082 (2015.10); B23K 26/359 (2015.10); B23K 26/402 (2013.01); H01L 33/0093 (2020.05); B23K 2103/56 (2018.08); B32B 7/12 (2013.01); B32B 9/041 (2013.01); B32B 15/043 (2013.01); B32B 15/20 (2013.01); B32B 43/006 (2013.01); B32B 2311/04 (2013.01); B32B 2311/06 (2013.01); B32B 2311/09 (2013.01); B32B 2311/12 (2013.01); B32B 2315/00 (2013.01)] 1 Claim
OG exemplary drawing
 
1. A method of operating a laser processing apparatus, the laser apparatus comprising:
a chuck table that holds a workpiece and includes a holding surface defined by an X-axis and a Y-axis; and
a laser beam irradiation unit that irradiates the workpiece held by the chuck table with a laser beam and forms a broken layer, wherein
the laser beam irradiation unit includes
a laser oscillator that emits the laser beam,
a Y-axis scanner that executes a high-speed scan with the laser beam emitted from the laser oscillator in a Y-axis direction,
an X-axis scanner that executes processing feed of the laser beam emitted from the laser oscillator in an X-axis direction, and
a beam condenser,
wherein the beam condenser is configured to output a spot diameter (D) of the laser beam with which the workpiece is irradiated of 5 to 60 μm, wherein the beam condenser and the X-axis scanner are configured to output an overlap rate (K) of a spot of the laser beam of 0.70 to 0.99, wherein the Y-axis scanner is configured to output a scan speed (Vy) in the Y-axis direction of 1 to 300 m/s, and wherein the laser oscillator is configured to output an energy (E) of the laser beam per one pulse of 0.07 to 50 μJ,
the method comprising the steps of:
scanning the workpiece with the laser beam wherein
a repetition frequency (H) of the laser beam is set to:
H=Vy/{D·(1−K)} MHz,
a scan speed (Vx) in the X-axis direction is set to:
Vx=D·(1−K)·Vy/L mm/s,
where a width of the scan by the Y-axis scanner is defined as L mm, and
an average output power (P) of the laser beam is set to:
P=E·Vy/{D·(1−K)} W.