US 12,484,376 B2
Display panel and manufacturing method therefor, display screen, and electronic device
Haohui Long, Shenzhen (CN); Shanshan Wei, Shenzhen (CN); Jianping Fang, Shenzhen (CN); and Xiaolong Li, Shenzhen (CN)
Assigned to Honor Device Co., Ltd., Shenzhen (CN)
Appl. No. 18/022,392
Filed by Honor Device Co., Ltd., Shenzhen (CN)
PCT Filed Oct. 22, 2021, PCT No. PCT/CN2021/125897
§ 371(c)(1), (2) Date Feb. 21, 2023,
PCT Pub. No. WO2022/042771, PCT Pub. Date Mar. 3, 2022.
Claims priority of application No. 202010899632.1 (CN), filed on Aug. 31, 2020.
Prior Publication US 2023/0329070 A1, Oct. 12, 2023
Int. Cl. H10K 39/12 (2023.01); H10K 59/12 (2023.01); H10K 59/121 (2023.01); H10K 59/124 (2023.01); H10K 59/40 (2023.01); H10K 59/80 (2023.01); H10K 59/65 (2023.01); H10K 71/00 (2023.01)
CPC H10K 59/121 (2023.02) [H10K 59/1201 (2023.02); H10K 59/124 (2023.02); H10K 59/40 (2023.02); H10K 59/873 (2023.02); H10K 59/8731 (2023.02); H10K 59/8792 (2023.02); H10K 59/65 (2023.02); H10K 59/8791 (2023.02); H10K 71/00 (2023.02)] 10 Claims
OG exemplary drawing
 
1. A display panel, comprising:
a thin film transistor backplane;
an organic layer; and
a packaging layer, wherein the thin film transistor backplane, the organic layer, and the packaging layer are successively stacked;
wherein the display panel is provided with a through hole, wherein runs through the thin film transistor backplane, the organic layer, and the packaging layer;
wherein the display panel comprises a non-display area and a display area, the non-display area being disposed around the through hole and the display area being disposed around the non-display area;
wherein the organic layer comprises a first organic layer and a second organic layer, the first organic layer is partially located in the display area, and the second organic layer is partially located in the non-display area, wherein the first organic layer comprises a plurality of display devices, the second organic layer is provided with a first groove that runs through the second organic layer, and the first groove is disposed around the through hole; and
wherein the packaging layer covers the organic layer and is filled in the first groove.