US 12,484,302 B2
Method for manufacturing drive circuit, drive circuit and photomask
Xiaozhen Sun, Shenzhen (CN); Tianhui Qiu, Shenzhen (CN); and Haoxuan Zheng, Shenzhen (CN)
Assigned to HKC CORPORATION LIMITED, Shenzhen (CN)
Appl. No. 17/801,449
Filed by HKC CORPORATION LIMITED, Guangdong (CN)
PCT Filed Dec. 30, 2021, PCT No. PCT/CN2021/143322
§ 371(c)(1), (2) Date Jun. 5, 2024,
PCT Pub. No. WO2022/247280, PCT Pub. Date Dec. 1, 2022.
Claims priority of application No. 202110576057.6 (CN), filed on May 26, 2021.
Prior Publication US 2024/0347552 A1, Oct. 17, 2024
Int. Cl. H10D 86/01 (2025.01); G03F 1/40 (2012.01); G03F 7/00 (2006.01); G03F 7/40 (2006.01); G03F 7/42 (2006.01); G09G 3/00 (2006.01)
CPC H10D 86/0231 (2025.01) [G03F 1/40 (2013.01); G03F 7/0007 (2013.01); G03F 7/40 (2013.01); G03F 7/42 (2013.01); G09G 3/006 (2013.01); G09G 2330/12 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method for manufacturing a drive circuit, the drive circuit having a pixel control circuit, the method comprising:
covering a conductive layer on a substrate;
covering a photoresist layer on the conductive layer;
covering a photomask on the photoresist layer and performing exposure; wherein the photomask comprises pixel control circuit patterns, and the pixel control circuit patterns are provided with a plurality of interruptions configured to release static electricity generated in the pixel control circuit pattern during exposure, and a length of the interruption between two adjacent pixel control circuit patterns is a preset distance;
developing to the photoresist layer, and removing an area of the photoresist layer not covered by the pixel control circuit patterns to form a photoresist area; and
etching the conductive layer, and removing an area of the conductive layer not covered by the photoresist area to form the pixel control circuit;
wherein the pixel control circuit comprises a first color pixel control circuit, a second color pixel control circuit and a third color pixel control circuit; and
the pixel control circuit patterns comprise a first color pixel control circuit pattern, a second color pixel control circuit pattern and, a third color pixel control circuit pattern;
the step of developing to the photoresist layer, and removing an area of the photoresist layer not covered by the pixel control circuit patterns to form a photoresist area comprises:
developing to the photoresist layer, and removing an area of the photoresist layer not covered by the first pixel control circuit pattern to form a first sub-photoresist area;
developing to the photoresist layer, and removing an area of the photoresist layer not covered by the second pixel control circuit pattern to form a second sub-photoresist area; and
developing to the photoresist layer, and removing an area of the photoresist layer not covered by the third pixel control circuit pattern to form a third sub-photoresist area.