US 12,484,286 B2
Transistor and semiconductor device
Toru Hiyoshi, Osaka (JP)
Assigned to Sumitomo Electric Industries, Ltd., Osaka (JP)
Appl. No. 17/792,160
Filed by SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
PCT Filed Mar. 25, 2021, PCT No. PCT/JP2021/012554
§ 371(c)(1), (2) Date Jul. 12, 2022,
PCT Pub. No. WO2021/200543, PCT Pub. Date Oct. 7, 2021.
Claims priority of application No. 2020-060648 (JP), filed on Mar. 30, 2020.
Prior Publication US 2023/0049852 A1, Feb. 16, 2023
Int. Cl. H01L 25/07 (2006.01); H01L 23/00 (2006.01); H10D 30/66 (2025.01); H10D 62/832 (2025.01); H10D 64/27 (2025.01); H10D 64/66 (2025.01)
CPC H10D 64/518 (2025.01) [H01L 25/072 (2013.01); H10D 30/668 (2025.01); H10D 62/8325 (2025.01); H10D 64/661 (2025.01); H01L 24/48 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/48225 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/13091 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A transistor comprising:
a wide bandgap semiconductor layer including a plurality of transistor cells having a channel region;
a gate insulating film disposed on the wide bandgap semiconductor layer;
a gate electrode disposed in a region opposing the channel region with the gate insulating film therebetween;
an interlayer insulating film covering the wide bandgap semiconductor layer, the gate insulating film, and the gate electrode;
a gate pad made of a conductive material, disposed on the interlayer insulating film; and
a gate runner made of a conductive material, disposed in a position on the interlayer insulating film away from the gate pad;
as viewed in a thickness direction of the wide bandgap semiconductor layer, the gate electrode extending from the region opposing the channel region to a region where the gate pad is located and a region where the gate runner is located,
the interlayer insulating film including a first opening arranged in the region where the gate pad is located and penetrating in a thickness direction of the interlayer insulating film, and a second opening arranged in the region where the gate runner is located and penetrating in the thickness direction of the interlayer insulating film,
the gate pad being connected to the gate electrode by filling in the first opening,
the gate runner being connected to the gate electrode by filling in the second opening,
the gate electrode including
a first region connected to the gate pad,
a second region connected to the gate runner,
a two third regions, and
a fourth region arranged between the two third regions,
wherein the two third regions and the fourth region are arranged between the first and second regions and in positions different from each other in a first direction which is indicated by a direction from the first region to the second region,
in a cross section perpendicular to the first direction, the gate electrode in the fourth region having a cross-sectional area smaller than a cross-sectional area of the gate electrode in the two third regions,
wherein the gate electrode in the fourth region has a through hole that penetrates in the thickness direction of the wide bandgap semiconductor layer.