US 12,484,152 B2
Electronic module and apparatus
Mitsutoshi Hasegawa, Kanagawa (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Jan. 3, 2023, as Appl. No. 18/149,330.
Claims priority of application No. 2022-001734 (JP), filed on Jan. 7, 2022.
Prior Publication US 2023/0225054 A1, Jul. 13, 2023
Int. Cl. H05K 1/18 (2006.01); H05K 3/32 (2006.01); H10F 39/00 (2025.01); H01L 23/00 (2006.01)
CPC H05K 1/181 (2013.01) [H05K 3/321 (2013.01); H10F 39/809 (2025.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/73 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/2036 (2013.01); H10F 39/804 (2025.01)] 30 Claims
OG exemplary drawing
 
1. An electronic module comprising:
a plurality of electronic components including a first electronic component having a first electrode on a principal surface of the first electronic component and a second electronic component having a second electrode on a principal surface of the second component, the second electronic component being disposed adjacent to the first electronic component;
a wiring board including a third electrode and a fourth electrode on a principal surface of the wiring board;
a conductive resin portion including a first conductive resin portion joining the first electrode with the third electrode, and a second conductive resin portion joining the second electrode with the fourth electrode; and
a reinforcing resin portion disposed at least between the first conductive resin portion and the second conductive resin portion,
wherein the reinforcing resin portion is disposed to straddle the principal surface of the first electronic component and the principal surface of the second electronic component, and the reinforcing resin portion joining each of the principal surfaces of the first and second electronic components with the principal surface of the wiring board.