| CPC H05K 1/111 (2013.01) [H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 2201/10159 (2013.01)] | 11 Claims |
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1. A printed circuit board comprising:
a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; and
a bridge embedded in at least one of the plurality of insulating layers of the wiring substrate at a depth such that an upper surface of a body of the bridge is below an upper surface of a wiring layer of the plurality of wiring layers disposed on the at least one of the plurality of insulating layers of the wiring substrate, and having a plurality of connection pads disposed on the upper surface of the body of the bridge,
wherein an uppermost wiring layer of the plurality of wiring layers includes a plurality of bump pads connected to the plurality of connection pads,
the plurality of connection pads include a row of connection pads spaced apart from each other,
the plurality of bump pads include a row of bump pads spaced apart from each other, and
each distance between center lines of every two adjacent connection pads of the row of connection pads is larger than each distance between center lines of every two adjacent bump pads of the row of bump pads,
the plurality of connection pads have a size greater than the plurality of bump pads.
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