| CPC H05K 1/025 (2013.01) [H05K 1/117 (2013.01); H05K 2201/09709 (2013.01); H05K 2201/10318 (2013.01)] | 14 Claims |

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1. A printed circuit board comprising:
a dielectric; and
a connector mounted on the dielectric, the connector including a first connector lead, a first contact point, and a first connector wipe, the first connector wipe including a plurality of low impedance bumps, wherein the low impedance bumps create an impedance mismatch between the first connector lead and the first connector wipe, wherein a first portion of a signal transmitted along the connector lead is provided to a contact in physical communication with the first contact portion and a second portion of the signal is provided along the first connector wipe, and wherein a first signal propagation velocity for the first portion of the signal along the contact is slower than a second signal propagation velocity for the second portion of the signal along the first connector wipe.
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