US 12,483,772 B2
Image sensor package and endoscope
Shangyi Wu, Hsinchu (TW); Jia-De Zhou, Hsinchu (TW); Chih Lung Hsu, Hsinchu (TW); and Jiunwei Chen, Hsinchu (TW)
Assigned to MEDIMAGING INTEGRATED SOLUTION, INC., Hsinchu (TW)
Filed by Medimaging Integrated Solution, Inc., Hsinchu (TW)
Filed on Mar. 21, 2023, as Appl. No. 18/124,201.
Claims priority of application No. 111110697 (TW), filed on Mar. 22, 2022.
Prior Publication US 2023/0308738 A1, Sep. 28, 2023
Int. Cl. H04N 23/56 (2023.01); A61B 1/00 (2006.01); A61B 1/06 (2006.01); H01L 23/34 (2006.01); H01L 23/60 (2006.01); H04N 23/50 (2023.01); H04N 23/52 (2023.01); H10F 55/255 (2025.01); H10F 77/30 (2025.01); H10F 77/50 (2025.01)
CPC H04N 23/56 (2023.01) [A61B 1/00097 (2022.02); A61B 1/0684 (2013.01); H01L 23/34 (2013.01); H01L 23/60 (2013.01); H04N 23/52 (2023.01); H04N 23/555 (2023.01); H10F 55/255 (2025.01); H10F 77/334 (2025.01); H10F 77/50 (2025.01)] 25 Claims
OG exemplary drawing
 
1. An image sensor package, comprising
a substrate, having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of first electric-conduction contacts; the second surface has a plurality of second electric-conduction contacts and a plurality of third electric-conduction contacts; the plurality of second electric-conduction contacts and the plurality of third electric-conduction contacts are respectively electrically connected with the plurality of corresponding first electric-conduction contacts, two corners of an upper edge of the substrate respectively have a chamfer, and a lower edge of the substrate is formed with a recess for accommodating a working channel;
an image sensor, disposed on the second surface of the substrate and electrically connected with the plurality of second electric-conduction contacts, wherein an upper edge and a lower edge of the image sensor are close to edges of the substrate; and
at least one light-emitting element, disposed on the substrate with an offset relative to the image sensor such that the at least one light-emitting element is shifted toward the working channel, including
a spacer, having a third surface and a fourth surface opposite to the third surface, wherein the third surface has a plurality of fourth electric-conduction contacts; the fourth surface has a plurality of fifth electric-conduction contacts; the plurality of fifth electric-conduction contacts is electrically connected with the plurality of corresponding fourth electric-conduction contacts;
at least one light-emitting diode (LED), disposed on the fourth surface of the spacer and electrically connected with the plurality of fifth electric-conduction contacts,
wherein the light-emitting element is disposed on the second surface of the substrate and neighbors the image sensor; the plurality of fourth electric-conduction contacts is electrically connected with the plurality of corresponding third electric-conduction contacts; the spacer has a predetermined thickness to make a height of a light input surface of the image sensor greater than or equal to a height of a light output surface of the LED and make a difference of the height of the light input surface and the height of the light output surface smaller than or equal to a predetermined value; and
an encapsulant body, disposed on sidewalls of the image sensor, the spacer and the LED, wherein a top surface of the package body is lower than or equal to a height of the at least one LED, and the encapsulant body does not cover a light-emitting surface of the at least one LED.