| CPC H01Q 9/0414 (2013.01) [H01Q 1/422 (2013.01)] | 18 Claims |
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1. An electronic device comprising:
a housing forming at least a part of an exterior of the electronic device;
a printed circuit board (PCB) disposed in the housing;
a dielectric layer disposed between at least the PCB and the housing, wherein the dielectric layer comprises a first surface facing a surface of the housing and a second surface facing the PCB;
a patch antenna disposed on the first surface of the dielectric layer and electrically connected to a first point of the PCB;
a conductive plate disposed adjacent to the second surface of the dielectric layer and overlapping with the patch antenna, wherein the conductive plate is connected to a ground on the PCB through a second point spaced apart from the first point;
a first conducti comprising a conductive material, extending from the conductive plate and disposed adjacent to the second surface; and
a wireless communication circuit, comprising processor circuitry, electrically connected to the PCB,
wherein the wireless communication circuit is configured to feed power to the patch antenna through the first point of the PCB to:
transmit and/or receive a first signal of a first frequency band;
transmit and/or receive a second signal of a second frequency band different from the first frequency band through a first electric path comprising the patch antenna, the conductive plate, and the ground; and
feed power to the patch antenna through the first point to transmit and/or receive a third signal of a third frequency band through a second electric path comprising the patch antenna, the conductive plate, the first conductive member, and the ground, the third frequency band being different from the first frequency band and the second frequency band.
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