US 12,482,936 B2
Multi-band antenna module
Chul Hwang, Incheon (KR)
Assigned to AMOTECH CO., LTD., Incheon (KR)
Appl. No. 18/701,227
Filed by AMOTECH CO., LTD., Incheon (KR)
PCT Filed Oct. 7, 2022, PCT No. PCT/KR2022/015202
§ 371(c)(1), (2) Date Apr. 13, 2024,
PCT Pub. No. WO2023/063665, PCT Pub. Date Apr. 20, 2023.
Claims priority of application No. 10-2021-0136211 (KR), filed on Oct. 14, 2021.
Prior Publication US 2024/0421479 A1, Dec. 19, 2024
Int. Cl. H01Q 1/52 (2006.01); H01Q 5/307 (2015.01); H01Q 5/50 (2015.01); H01Q 9/04 (2006.01)
CPC H01Q 5/307 (2015.01) [H01Q 1/521 (2013.01); H01Q 5/50 (2015.01); H01Q 9/0414 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A multi-band antenna module comprising:
a circuit board configured by stacking a first metal layer on an upper surface of a resin layer and stacking a second metal layer on a lower surface of the resin layer,
wherein a first upper clearance area formed in a direction from a first side surface of the circuit board toward a center point of the circuit board,
a second upper clearance area formed in a direction from a second side surface of the circuit board in contact with the first side surface of the circuit board to the center point of the circuit board and spaced apart from the first upper clearance area,
an upper radiator surrounded by the first and second side surfaces of the circuit board, the first upper clearance area, and the second upper clearance area,
an upper ground surrounded by third and fourth side surfaces of the circuit board that are opposite to the first and second side surfaces of the circuit board, the first upper clearance area, and the second upper clearance area,
a first conductor area disposed in the first upper clearance area and connected to the upper radiator to feed the upper radiator, and
a second conductor area disposed in the second upper clearance area and connected to the upper radiator to feed the upper radiator are defined on an upper surface of the circuit board.