US 12,482,780 B2
Chip package structure including an underfill material portion comprising a cut region
Chia-Kuei Hsu, Hsinchu (TW); Ming-Chih Yew, Hsinchu (TW); Li-Ling Liao, Hsinchu (TW); Po-Yao Lin, Zhudong Township (TW); and Shin-Puu Jeng, Po-Shan Village (TW)
Assigned to Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed on Apr. 6, 2022, as Appl. No. 17/714,416.
Prior Publication US 2023/0326898 A1, Oct. 12, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/32 (2013.01) [H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2784 (2013.01); H01L 2224/32059 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83947 (2013.01); H01L 2924/15172 (2013.01); H01L 2924/3512 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A chip package structure, comprising:
at least one semiconductor die attached to a redistribution structure;
a molding compound die frame laterally surrounding the at least one semiconductor die; and
a first underfill material portion located between the redistribution structure and the at least one semiconductor die and contacting sidewalls of the at least one semiconductor die and sidewalls of the molding compound die frame, the first underfill material portion comprising at least one cut region, wherein the first underfill material portion comprises a vertically-extending portion having a uniform lateral width and a horizontally-extending portion having a uniform vertical thickness and adjoined to a bottom end of the vertically-extending portion within each of the at least one cut region,
wherein the at least one semiconductor die has a rectangular outer periphery in a plan view; and
wherein the at least one cut region comprises four cut regions located outside, and in proximity to, four corners of the rectangular outer periphery.