US 12,482,777 B2
Copper pillar bump structure and method of manufacturing the same
Chen-Hsiao Wang, Hsinchu (TW); and Kai-Kuang Ho, Hsinchu (TW)
Assigned to UNITED MICROELECTRONICS CORP., Hsin-Chu (TW)
Filed by UNITED MICROELECTRONICS CORP., Hsin-Chu (TW)
Filed on Aug. 29, 2022, as Appl. No. 17/898,478.
Claims priority of application No. 111125647 (TW), filed on Jul. 8, 2022.
Prior Publication US 2024/0014158 A1, Jan. 11, 2024
Int. Cl. H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01)
CPC H01L 24/13 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 24/11 (2013.01); H01L 21/563 (2013.01); H01L 23/3171 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/13011 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13018 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13541 (2013.01); H01L 2224/13552 (2013.01); H01L 2224/13564 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13611 (2013.01); H01L 2924/35121 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A copper pillar bump structure, comprising:
a substrate;
a bonding pad on said substrate;
a passivation layer covering said substrate and exposing said bonding pad;
a copper pillar on said passivation layer and said bonding pad and connecting directly with said bonding pad, wherein said copper pillar is provided with an upper part and a lower part, an upper surface of said lower part is provided with a first upper surface and a second upper surface, and said second upper surface is at one side of said first upper surface, and said upper part of said copper pillar is on said first upper surface of said lower part; and
a metal bump on said copper pillar, wherein parts of said metal bump directly contact said second upper surface of said lower part of said copper pillar.