US 12,482,767 B2
Integrated package electronic device structure
Xin Liu, Kunshan (CN); and Shuyu Yan, Kunshan (CN)
Assigned to DYNAX SEMICONDUCTOR, INC., Kunshan (CN)
Appl. No. 17/637,364
Filed by DYNAX SEMICONDUCTOR, INC., Kunshan (CN)
PCT Filed Aug. 21, 2020, PCT No. PCT/CN2020/110470
§ 371(c)(1), (2) Date Feb. 22, 2022,
PCT Pub. No. WO2021/032189, PCT Pub. Date Feb. 25, 2021.
Claims priority of application No. 201910779583.5 (CN), filed on Aug. 22, 2019.
Prior Publication US 2022/0293536 A1, Sep. 15, 2022
Int. Cl. H01L 23/66 (2006.01); H01L 25/16 (2023.01); H01L 23/00 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 25/16 (2013.01); H01L 24/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/665 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6672 (2013.01); H01L 2223/6688 (2013.01); H01L 2224/48195 (2013.01); H01L 2924/1421 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An integrated package electronic device structure comprising:
a packaging component comprising a packaging frame and a packaging substrate;
at least two circuit modules packaged on one side of the packaging substrate within the packaging frame;
wherein the packaging frame comprises a merge point for the at least two circuit modules;
an integrated passive device area packaged on one side of the packaging substrate within the packaging frame;
wherein the at least two circuit modules are located in the integrated passive device area;
at least two connection circuits are formed between the integrated passive device area and the packaging frame; and
wherein the at least two circuit modules comprise a matching circuit module and a grounding circuit module, wherein the matching circuit module and the grounding circuit module are electrically connected to the packaging frame, respectively, wherein one end of the grounding circuit module is electrically connected to the packaging frame via a resonant inductor Ls, and wherein one end of the matching circuit module is electrically connected to the packaging frame via an radio frequency choke RFC.