US 12,482,742 B2
Enhanced linerless vias
Ruilong Xie, Niskayuna, NY (US); Oleg Gluschenkov, Tannersville, NY (US); Yasir Sulehria, Niskayuna, NY (US); Julien Frougier, Albany, NY (US); and Veeraraghavan S. Basker, Schenectady, NY (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Dec. 30, 2021, as Appl. No. 17/646,572.
Prior Publication US 2023/0215800 A1, Jul. 6, 2023
Int. Cl. H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H10D 30/01 (2025.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01); H10D 64/01 (2025.01)
CPC H01L 23/5226 (2013.01) [H01L 21/76804 (2013.01); H01L 21/76879 (2013.01); H01L 23/5283 (2013.01); H10D 30/031 (2025.01); H10D 30/6713 (2025.01); H10D 30/6729 (2025.01); H10D 30/6735 (2025.01); H10D 62/118 (2025.01); H10D 64/01 (2025.01)] 14 Claims
OG exemplary drawing
 
1. An electronic package comprising:
a first layer;
a second layer; and
a via layer between the first layer and the second layer comprising an asymmetric via formed in the via layer, wherein the asymmetric via comprises:
a top side that contacts the second layer;
a bottom side that contacts the first layer, wherein the bottom side is parallel with the top side;
a first sidewall with a first slope angle in a first direction between the first layer and the second layer; and
a second sidewall with a second slope angle in the first direction between the first layer and the second layer, wherein the second slope angle is different from the first slope angle.