US 12,482,731 B2
Multi-level 3D stacked package and methods of forming the same
Julio C. Costa, Oak Ridge, NC (US); George Maxim, Saratoga, CA (US); and Baker Scott, San Jose, CA (US)
Assigned to Qorvo US, Inc., Greensboro, NC (US)
Appl. No. 18/254,162
Filed by Qorvo US, Inc., Greensboro, NC (US)
PCT Filed Dec. 13, 2021, PCT No. PCT/US2021/063094
§ 371(c)(1), (2) Date May 23, 2023,
PCT Pub. No. WO2022/126016, PCT Pub. Date Jun. 16, 2022.
Claims priority of provisional application 63/124,456, filed on Dec. 11, 2020.
Prior Publication US 2024/0030117 A1, Jan. 25, 2024
Int. Cl. H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/49816 (2013.01) [H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/32146 (2013.01); H01L 2224/32235 (2013.01); H01L 2224/73253 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06586 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/182 (2013.01)] 26 Claims
OG exemplary drawing
 
1. A multi-level three-dimensional (3D) package comprising:
a lower package level that includes a lower redistribution structure and a lower die section over the lower redistribution structure, wherein:
the lower die section includes a lower thinned die, a lower mold compound, a lower intermediary mold compound, and lower vertical via structures, wherein the lower thinned die and the lower mold compound are deposed over the lower redistribution structure, the lower mold compound surrounds the lower thinned die and extends vertically beyond a top surface of the lower thinned die to define a lower opening over the lower thinned die and within the lower mold compound, the lower intermediary mold compound resides over the lower thinned die and fills the lower opening within the lower mold compound, and each lower vertical via structure extends through the lower mold compound;
the lower thinned die includes no silicon substrate and has a thickness less than 100 micrometers; and
a top surface of the lower intermediary mold compound and a top surface of the lower mold compound are coplanar; and
an upper package level that includes an upper redistribution structure over the lower package level and an upper die section over the upper redistribution structure, wherein:
the upper die section includes an upper thinned die, an upper mold compound, and an upper intermediary mold compound, wherein the upper thinned die and the upper mold compound are deposed over the upper redistribution structure, the upper mold compound surrounds the upper thinned die and extends vertically beyond a top surface of the upper thinned die to define an upper opening over the upper thinned die and within the upper mold compound, and the upper intermediary mold compound resides over the upper thinned die and fills the upper opening within the upper mold compound;
the upper thinned die includes no silicon substrate and has a thickness less than 100 micrometers; and
a top surface of the upper intermediary mold compound and a top surface of the upper mold compound are coplanar.