US 12,482,716 B2
Power module, preparation mold, and device
Fankun Wu, Shanghai (CN); Yunfei Qiao, Shanghai (CN); and Junhe Wang, Shanghai (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Guangdong (CN)
Filed on Jan. 26, 2023, as Appl. No. 18/159,754.
Application 18/159,754 is a continuation of application No. PCT/CN2020/105291, filed on Jul. 28, 2020.
Prior Publication US 2023/0170269 A1, Jun. 1, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/3121 (2013.01) [H01L 21/565 (2013.01); H01L 23/293 (2013.01); H01L 23/49811 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73265 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A power module, comprising:
a substrate, wherein a component is disposed on the substrate, and the component is electrically connected to the substrate;
a sealing layer, disposed at an interval from the substrate, wherein the substrate and the sealing layer are separated by a filling space;
a plastic packaging layer, wherein the filling space between the substrate and the sealing layer is filled with the plastic packaging layer, the component is packaged by the plastic packaging layer, and the plastic packaging layer is prepared by a thermosetting material; and
pins, wherein the pins penetrate the sealing layer and the plastic packaging layer and are electrically connected to the substrate, the pins are partially exposed on a first surface of the sealing layer, and the first surface of the sealing layer faces away from the plastic packaging layer.