US 12,482,694 B2
Electronic package and suction device
Chun Hung Tsai, Kaohsiung (TW); Chenghan She, Kaohsiung (TW); Kuo-Chih Huang, Kaohsiung (TW); and Kuan-Lin Yeh, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Apr. 1, 2022, as Appl. No. 17/711,762.
Prior Publication US 2023/0317502 A1, Oct. 5, 2023
Int. Cl. H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01)
CPC H01L 21/6838 (2013.01) [H01L 21/67144 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/1416 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method for manufacturing an electronic package, comprising:
providing an electronic component having a first surface and including a plurality of conductive studs on the first surface;
providing a suction device having at least one recess;
aligning an edge of the at least one recess to a space between two adjacent conductive studs of the plurality of conductive studs;
moving the electronic component with the suction device;
positioning one of the plurality of conductive studs inside a vertical projection area of one of the at least one recess and positioning the other one of the plurality of conductive studs outside the vertical projection area before the electronic component is moved by the suction device; and
enclosing the one of the plurality of conductive studs partially into the one of the at least one recess, wherein the one of the plurality of conductive studs includes a first portion horizontally overlapping the edge of the at least one recess and a second portion free from horizontally overlapping the edge of the at least one recess.