US 12,482,685 B2
Apparatus and methods for automatically handling die carriers
Tsung-Sheng Kuo, Hsin-Chu (TW); Cheng-Lung Wu, Hsin-Chu (TW); Chih-Hung Huang, Hsin-Chu (TW); Yang-Ann Chu, Hsin-Chu (TW); Hsuan Lee, Tainan (TW); and Jiun-Rong Pai, Jhubei (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed on Nov. 9, 2022, as Appl. No. 17/984,096.
Application 17/984,096 is a continuation of application No. 16/886,115, filed on May 28, 2020, granted, now 11,508,596.
Prior Publication US 2023/0063707 A1, Mar. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); H01L 21/677 (2006.01); G03F 1/66 (2012.01)
CPC H01L 21/67742 (2013.01) [H01L 21/67745 (2013.01); H01L 21/67754 (2013.01); H01L 21/67757 (2013.01); G03F 1/66 (2013.01); H01L 21/67772 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for handling die carriers, comprising:
at least one load port each configured to load a die carrier operable to hold a plurality of dies; and
an interface tool, wherein:
the interface tool is connected, via a first interface, to the at least one load port along a first direction;
the interface tool is connected, via a second interface, to a process chamber along a second direction different from the first direction; and
the interface tool comprises at least one robotic arm configured to clamp on the die carrier to swing the die carrier from the at least one load port to the interface tool, and wherein the at least one robotic arm is further configured to grab and hold the die carrier to transport the die carrier from the interface tool to the process chamber for processing at least one die in the die carrier.