US 12,482,682 B2
Systems and methods for inspection stations
Yan-Hong Liu, Zhudong Township, Hsinchu County (TW); Chien-Chih Wu, Hsinchu (TW); and Che-Fu Chen, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jun. 19, 2024, as Appl. No. 18/747,943.
Application 18/747,943 is a continuation of application No. 17/074,191, filed on Oct. 19, 2020, granted, now 12,040,205.
Application 17/074,191 is a continuation of application No. 15/987,604, filed on May 23, 2018, granted, now 10,811,290.
Prior Publication US 2024/0339344 A1, Oct. 10, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); G06T 7/00 (2017.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01); H04N 25/71 (2023.01)
CPC H01L 21/67288 (2013.01) [G06T 7/0004 (2013.01); H01L 21/67742 (2013.01); H01L 21/68707 (2013.01); H01L 21/68764 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/30148 (2013.01); G06T 2207/30164 (2013.01); H04N 25/71 (2023.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor workstation, comprising:
a semiconductor processing chamber configured to receive and process a workpiece;
a robotic arm configured to transfer the workpiece between the semiconductor processing chamber and another location; and
an inspection station comprising:
a plurality of top defect sensors disposed on a ceiling of the inspection station and configured to gather at least two different types of first defect data characterizing a top surface of the workpiece; and
a plurality of bottom defect sensors disposed on a floor of the inspection station and configured to gather at least two different types of second defect data characterizing a bottom surface of the workpiece,
wherein the plurality of top defect sensors comprise an optical defect sensor and a temperature defect sensor and the plurality of bottom defect sensors comprise an optical defect sensor and a temperature defect sensor.