| CPC H01L 21/67057 (2013.01) [H01L 21/02057 (2013.01); H01L 21/67034 (2013.01); H01L 21/67248 (2013.01); H01L 21/67253 (2013.01)] | 20 Claims |

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14. A cleaning chamber, comprising:
a tank region configured to accommodate a tank solution;
a drying region configured to accommodate a gas;
a solvent source configured to provide a solvent layer between the tank region and the drying region to separate the tank solution and the gas;
at least one sensor configured to measure a parameter value from the gas after a wafer is removed from the tank region through the solvent layer and placed within the drying region; and
at least one processor configured to:
determine, based on the parameter value measured by the at least one sensor, that a first parameter value from the gas exceeds a first predetermined threshold value;
determine, based on the parameter value measured by the at least one sensor, that a second parameter value from the gas exceeds a second predetermined threshold value, the second predetermined threshold value being a different type than that of the first predetermined threshold value;
determine, based on the parameter value measured by the at least one sensor, that a third parameter value from the gas exceeds a third predetermined threshold value, the third predetermined threshold value being a different type than that of the first predetermined threshold value;
perform a first remediation in response to determining that the first parameter value exceeds the first predetermined threshold value;
perform a second remediation in response to determining that the second parameter value exceeds the second predetermined threshold value, the second remediation being a different type than that of the first remediation; and
performing a third remediation in response to determining that the third parameter value exceeds the third predetermined threshold value, the third remediation being a different type than that of the first remediation,
wherein the first predetermined threshold value comprises a first value representing a threshold amount of NH3 within the gas in the drying region and the first remediation comprises increasing a concentration of N2 in the drying region and increasing a temperature in the drying region, and
wherein the second predetermined threshold value comprises a second value representing a threshold amount of a volatile organic compound (VOC) within the gas in the drying region and the second remediation comprises introducing a solvent that forms the solvent layer as a vapor into the drying region and increasing the temperature in the drying region.
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