US 12,482,669 B2
Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
Takashi Watanabe, Yokkaichi Mie (JP)
Assigned to Kioxia Corporation, Tokyo (JP)
Filed by Kioxia Corporation, Tokyo (JP)
Filed on Aug. 27, 2022, as Appl. No. 17/897,127.
Claims priority of application No. 2022-036600 (JP), filed on Mar. 9, 2022.
Prior Publication US 2023/0290648 A1, Sep. 14, 2023
Int. Cl. H01L 21/463 (2006.01); B24B 1/00 (2006.01); H01L 21/477 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/463 (2013.01) [B24B 1/00 (2013.01); H01L 21/477 (2013.01); H01L 21/67103 (2013.01); H01L 21/67115 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A semiconductor manufacturing apparatus comprising:
a polishing head configured to hold a polishing object having a first surface and a second surface, the first surface being a surface to be polished, the second surface being opposite to the first surface, the polishing head having a lower surface facing the second surface, the lower surface having a central portion and an outer circumferential portion, and the polishing head having a plurality of laser irradiation units incorporated in the polishing head in a region from the central portion to the outer circumferential portion,
wherein at least one of the plurality of laser irradiation units is configured to irradiate a laser beam to the second surface of the polishing object.