US 12,482,651 B2
Substrate processing method and substrate processing apparatus
Kae Kumagai, Miyagi (JP); Toru Hisamatsu, Hillsboro, OR (US); and Masanobu Honda, Miyagi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Dec. 16, 2022, as Appl. No. 18/083,434.
Application 18/083,434 is a continuation of application No. 17/097,141, filed on Nov. 13, 2020, granted, now 11,545,355.
Claims priority of application No. 2019-205415 (JP), filed on Nov. 13, 2019; and application No. 2020-152825 (JP), filed on Sep. 11, 2020.
Prior Publication US 2023/0122980 A1, Apr. 20, 2023
Int. Cl. H01L 21/02 (2006.01); C23C 16/455 (2006.01); C23C 16/52 (2006.01); H01J 37/32 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01); H01L 21/66 (2006.01)
CPC H01L 21/0228 (2013.01) [C23C 16/45527 (2013.01); C23C 16/45544 (2013.01); C23C 16/52 (2013.01); H01J 37/32449 (2013.01); H01L 21/02274 (2013.01); H01L 21/3065 (2013.01); H01L 21/308 (2013.01); H01L 22/26 (2013.01); H01J 2237/3321 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An apparatus for processing a substrate, comprising:
a chamber having a gas inlet and a gas outlet;
a substrate support disposed in the chamber;
a plasma generator; and
a controller having a processor and a memory with a computer readable program stored therein, the controller being programmed to:
(a) place a substrate on the substrate support, the substrate having a pattern,
(b) supply a first reactive species into the chamber to adsorb the first reactive species onto the pattern of the substrate,
(c) partially purge the first reactive species from the chamber to adjust an amount of a residual first reactive species in the chamber,
(d) supply a second reactive species into the chamber, and
(e) expose the substrate to a plasma generated from the residual first reactive species and the second reactive species by the plasma generator to form a film on the pattern of the substrate, a coverage of the film being determined by the adjusted amount of the residual first reactive species, the coverage being a ratio of a first thickness and a second thickness, the first thickness representing a thickness of the film at a first height, the second thickness representing a thickness of the film at a second height,
wherein the first height is greater than the second height, the first thickness is greater than the second thickness.