US 12,482,641 B2
Printed microwave resonator for measuring high electron density plasmas
David Peterson, San Jose, CA (US); David Coumou, Webster, NY (US); Chuang-Chia Lin, San Ramon, CA (US); Kelvin Chan, San Ramon, CA (US); Farzad Houshmand, Mountain View, CA (US); Ping-Hwa Hsieh, Milpitas, CA (US); and Kristopher Ford, Santa Clara, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jun. 9, 2023, as Appl. No. 18/208,174.
Prior Publication US 2024/0412959 A1, Dec. 12, 2024
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32917 (2013.01) [H01J 37/32935 (2013.01); H01J 2237/24507 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A module, comprising:
a substrate, wherein the substrate comprises a dielectric material;
a first microstrip resonator on the substrate;
a first microstrip transmission line on the substrate adjacent to the first microstrip resonator, wherein the first microstrip resonator is spaced from the first microstrip transmission line by a first gap;
a second microstrip resonator on the substrate, wherein a length of the second microstrip resonator is different than a length of the first microstrip resonator; and
a second microstrip transmission line on the substrate, wherein the second microstrip resonator is spaced from the second microstrip transmission line by a second gap that is different than the first gap; and
a ground plane on a surface of the substrate opposite from the first microstrip resonator and the second microstrip resonator.