US 12,482,590 B2
Magnetic power component and power module to which magnetic power component is applied
Xijun Zhang, Dongguan (CN); Jia Li, Xi′an (CN); Jun Yao, Dongguan (CN); Chao Gao, Dongguan (CN); Qiang Gao, Dongguan (CN); and Zhitao Li, Xi′an (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by Huawei Technologies Co., Ltd., Shenzhen (CN)
Filed on Aug. 25, 2022, as Appl. No. 17/895,507.
Claims priority of application No. 202110989889.0 (CN), filed on Aug. 26, 2021.
Prior Publication US 2023/0075194 A1, Mar. 9, 2023
Int. Cl. H01F 27/24 (2006.01); H01F 27/08 (2006.01); H05K 1/18 (2006.01)
CPC H01F 27/24 (2013.01) [H01F 27/08 (2013.01); H05K 1/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A magnetic power component, comprising:
a printed circuit board; and
a magnetic core assembled to the printed circuit board and comprising:
a magnetic core body bonded to the printed circuit board and comprising an outer surface facing away from the printed circuit board; and
a plurality of heat dissipation teeth bonded to the magnetic core body through direct contact and protruding from the outer surface, wherein the magnetic core body further comprises:
a first magnetic core part comprising:
a main body part comprising:
 a first surface facing away from the printed circuit board and comprising a first portion of the plurality of heat dissipation teeth; and
 a second surface facing the printed circuit board; and
a support part connected to the second surface and penetrating through the printed circuit board; and
a second magnetic core part comprising:
a third surface facing away from the printed circuit board and comprising a second portion of the plurality of heat dissipation teeth; and
a fourth surface facing the printed circuit board and connected to the support part,
wherein the printed circuit board is located between the main body part and the second magnetic core part, and
wherein the first magnetic core part further comprises a first bump integrally formed with the main body part and located on the second surface, or wherein the second magnetic core part further comprises a second bump located on the fourth surface and bonded to the printed circuit board.