US 12,482,579 B2
Wiring component, module, apparatus, and method for manufacturing module
Mitsutoshi Hasegawa, Kanagawa (JP); Noritake Tsuboi, Kanagawa (JP); Satoru Higuchi, Tokyo (JP); Takashi Aoki, Chiba (JP); and Koji Noguchi, Tokyo (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Mar. 29, 2022, as Appl. No. 17/707,669.
Claims priority of application No. 2021-059053 (JP), filed on Mar. 31, 2021.
Prior Publication US 2022/0319737 A1, Oct. 6, 2022
Int. Cl. H01B 7/08 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01)
CPC H01B 7/0823 (2013.01) [H01B 7/0846 (2013.01); H05K 1/145 (2013.01); H05K 3/3436 (2013.01); H05K 1/18 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/2036 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A wiring component comprising:
a first wiring portion including a first plurality of wirings arranged side by side in a first direction and including a first insulating member that supports the first plurality of wirings;
a second wiring portion including a second plurality of wirings arranged side by side in a second direction and including a second insulating member that supports the second plurality of wirings; and
a coupling portion configured to couple the first wiring portion and the second wiring portion to each other,
wherein an angle formed by the first direction and the second direction is changeable by deformation of the coupling portion,
wherein the first wiring portion and the second wiring portion are composed of one or more first materials,
wherein the one or more first materials are insulating materials,
wherein the coupling portion is composed of one or more second materials, and
wherein the one or more first materials are different from the one or more second materials.