US 12,481,259 B2
Building platform chip for digital twins
Miguel Galvez, Westford, MA (US); Richard J. Campero, Irvine, CA (US); Eric G. Lang, Milwaukee, WI (US); Abu Bakr Khan, Franklin, WI (US); Donald A. Gottschalk, Jr., Racine, WI (US); Daniel M. Curtis, Franklin, WI (US); Trent M. Swanson, Wellington, FL (US); and Karl F. Reichenberger, Mequon, WI (US)
Assigned to TYCO FIRE & SECURITY GMBH, Neuhausen am Rheinfall (CH)
Filed by Tyco Fire & Security GmbH, Neuhausen am Rheinfall (CH)
Filed on Jan. 13, 2023, as Appl. No. 18/096,965.
Application 18/096,965 is a continuation in part of application No. 17/710,775, filed on Mar. 31, 2022.
Claims priority of provisional application 63/411,540, filed on Sep. 29, 2022.
Claims priority of provisional application 63/299,772, filed on Jan. 14, 2022.
Claims priority of provisional application 63/296,078, filed on Jan. 3, 2022.
Prior Publication US 2023/0213909 A1, Jul. 6, 2023
Int. Cl. G05B 19/042 (2006.01)
CPC G05B 19/042 (2013.01) [G05B 2219/25011 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
activating a building platform chip integrated with a circuit board of a building device of a building and coupled, via at least one trace of the circuit board, with a processing circuit of the circuit board of the building device;
retrieving, by the building platform chip, first data from the processing circuit via the at least one trace of the building device through communication with the processing circuit;
generating, by the building platform chip using the retrieved first data, second data to cause a digital twin of the building device to be constructed; and
transmitting, by the building platform chip, the second data to a server to cause the server to construct the digital twin.