US 12,481,107 B2
Photonic computing platform
Jianhua Wu, Quincy, MA (US); Zhan Su, Boston, MA (US); Hui Chen, Wellesley Hills, MA (US); Huaiyu Meng, Medford, MA (US); and Yichen Shen, Cambridge, MA (US)
Assigned to Lightelligence PTE. Ltd., Singapore (SG)
Filed by Lightelligence PTE. Ltd., Singapore (SG)
Filed on Dec. 9, 2021, as Appl. No. 17/546,436.
Claims priority of provisional application 63/253,704, filed on Oct. 8, 2021.
Claims priority of provisional application 63/123,338, filed on Dec. 9, 2020.
Prior Publication US 2022/0179159 A1, Jun. 9, 2022
Int. Cl. G02B 6/42 (2006.01); G02B 6/124 (2006.01); G02B 6/34 (2006.01); G06E 1/00 (2006.01); G02B 7/00 (2021.01); G02B 27/62 (2006.01); G06N 3/067 (2006.01)
CPC G02B 6/4204 (2013.01) [G02B 6/34 (2013.01); G02B 6/4206 (2013.01); G02B 6/4214 (2013.01); G02B 6/4227 (2013.01); G02B 6/4244 (2013.01); G02B 6/4271 (2013.01); G06E 1/00 (2013.01); G02B 6/124 (2013.01); G02B 6/4269 (2013.01); G02B 6/4286 (2013.01); G02B 7/003 (2013.01); G02B 27/62 (2013.01); G06N 3/0675 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a support structure;
a photonic source attached to the support structure, the photonic source comprising:
a first laser die on a first substrate in which the first laser die is configured to provide a first optical beam,
a second laser die on the first substrate or a second substrate in which the second laser die is configured to provide a second optical beam, and
a third laser die on the first substrate or a third substrate in which the third laser die is configured to provide a third optical beam;
a photonic integrated circuit having a bottom side attached to the support structure, the photonic integrated circuit comprising:
a first waveguide and a first coupler coupled to the first waveguide,
a second waveguide and a second coupler coupled to the second waveguide, and
a third waveguide and a third coupler coupled to the third waveguide; and
a plurality of beam-shaping optical elements attached to at least one of the support structure, the first substrate, respective first, second, and third substrates, or the photonic integrated circuit, wherein the beam-shaping optical elements comprise:
a first beam-shaping optical element configured to couple the first optical beam to the first coupler on the photonic integrated circuit,
a second beam-shaping optical element configured to couple the second optical beam to the second coupler on the photonic integrated circuit, and
a third beam-shaping optical element configured to couple the third optical beam to the third coupler on the photonic integrated circuit,
wherein each of the plurality of beam-shaping optical elements is independently movable relative to the corresponding laser die, the corresponding coupler, and the other beam-shaping optical elements prior to alignment,
wherein each of the plurality of beam-shaping optical elements is individually aligned with the corresponding laser die and the corresponding coupler independent of the other beam-shaping optical elements; and
an electronic integrated circuit attached to a top side of the photonic integrated circuit;
wherein the photonic integrated circuit comprises at least one optical modulator, and the electronic integrated circuit comprises control circuitry configured to provide electronic control signals for controlling the at least one optical modulator;
wherein the support structure comprises an optoelectronic interposer that provides electrical signal paths for electrical signals from the photonic integrated circuit, and optical signal paths for optical signals from the photonic integrated circuit.