US 12,480,976 B2
Probe card and manufacturing method thereof
Chin-Yi Lin, Hsinchu County (TW); Che-Wei Lin, Hsinchu County (TW); Ting-Ju Wu, Hsinchu County (TW); and Chien-Kai Hung, Hsinchu County (TW)
Assigned to MPI CORPORATION, Hsinchu Shien (TW)
Filed by MPI Corporation, Hsinchu County (TW)
Filed on Dec. 19, 2023, as Appl. No. 18/544,756.
Application 18/544,756 is a continuation of application No. 17/518,311, filed on Nov. 3, 2021, granted, now 11,874,313.
Claims priority of application No. 109142123 (TW), filed on Nov. 30, 2020.
Prior Publication US 2024/0118316 A1, Apr. 11, 2024
Int. Cl. G01R 3/00 (2006.01); G01R 1/073 (2006.01)
CPC G01R 3/00 (2013.01) [G01R 1/07342 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A probe card, comprising:
a probe head;
a first substrate comprising an upper surface, wherein the upper surface comprises a plurality of first contacts;
a second substrate disposed between the probe head and the first substrate in a way that the second substrate is directly or indirectly electrically connected with the probe head, and disposed on the upper surface of the first substrate, wherein the second substrate comprises a lower surface and a side surface; the lower surface of the second substrate faces the upper surface of the first substrate, the lower surface of the second substrate comprises a plurality of second contacts, and each of the second contacts is electrically connected to a corresponding first contact;
an insulating component disposed between the upper surface of the first substrate and the lower surface of the second substrate and at an outer side of the second contacts of the second substrate in a way that at least one first through hole, through which an atmosphere is in communication with a space between the first substrate and the second substrate, is left between the first substrate and the second substrate; and
an adhesive member disposed on the upper surface of the first substrate and arranged on at least a part of the side surface of the second substrate, wherein the adhesive member is disposed at an outer side of the insulating component.