US 12,480,556 B2
Composite material capable of measuring bending deformation, spring including the same, and manufacturing method thereof
Seong Su Kim, Daejeon (KR); Hyunsoo Hong, Daejeon (KR); Muhammad Salman Sarfraz, Daejeon (KR); Seung Yoon On, Daejeon (KR); and Jaemoon Jeong, Daejeon (KR)
Assigned to KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, Daejeon (KR)
Filed by KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, Daejeon (KR)
Filed on Dec. 27, 2021, as Appl. No. 17/562,667.
Claims priority of application No. 10-2021-0048882 (KR), filed on Apr. 15, 2021; and application No. 10-2021-0165213 (KR), filed on Nov. 26, 2021.
Prior Publication US 2022/0333659 A1, Oct. 20, 2022
Int. Cl. G01N 27/22 (2006.01); B29C 65/00 (2006.01); B29C 70/30 (2006.01); F16F 1/368 (2006.01); G01B 7/16 (2006.01); B29K 63/00 (2006.01); B29K 307/04 (2006.01); B29L 31/00 (2006.01)
CPC F16F 1/368 (2013.01) [B29C 66/7212 (2013.01); B29C 66/727 (2013.01); B29C 70/30 (2013.01); G01B 7/22 (2013.01); B29K 2063/00 (2013.01); B29K 2307/04 (2013.01); B29L 2031/752 (2013.01); B29L 2031/774 (2013.01); F16F 2224/0225 (2013.01); F16F 2224/0241 (2013.01); F16F 2226/042 (2013.01); F16F 2230/0047 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A composite material capable of measuring bending deformation, the composite material comprising:
a planar homogenous first conductive composite body that is bendable;
a planar dielectric body that is bendable and compressible; and
a planar homogenous second conductive composite body that is bendable,
the composite material having a length dimension that is substantially larger than a thickness dimension, wherein the thickness of the composite material is comprised of the planar first conductive composite body, the planar dielectric body, and the planar second conductive composite body,
wherein the first conductive composite body and the second conductive composite body are respectively stacked on and connected to both surfaces of the dielectric body,
wherein when the composite material is bent with respect to the length dimension, the bending causes a compression of the planar dielectric body, which results in a change in capacitance between the first conductive composite body and the second conductive composite body,
wherein the change in capacitance is substantially greater due to bending along the length dimension compared to a force applied normal to the first or second composite body,
wherein the change in capacitance can be used to measure the bending deformation of the composite material,
wherein heights of the first conductive composite body and the second conductive composite body from the dielectric body are different from each other,
wherein the first conductive composite body is provided in an inner diameter direction and the second conductive composite body is provided in an outer diameter direction, and the second conductive composite body is thinner than the first conductive composite body.