US 12,479,959 B2
Polyamic acid composition, method for preparing polyamic acid composition, polyimide comprising the same and coating material comprising the same
In Hwan Hwang, Seoul (KR); Gyeong Hyeon Ro, Gyeongsangnam-do (KR); and Ik Sang Lee, Gyeongsangbuk-do (KR)
Assigned to PI ADVANCED MATERIALS CO., LTD., Chungcheongbuk-do (KR)
Appl. No. 17/624,839
Filed by PI ADVANCED MATERIALS CO., LTD., Chungcheongbuk-do (KR)
PCT Filed Oct. 30, 2019, PCT No. PCT/KR2019/014432
§ 371(c)(1), (2) Date Jan. 4, 2022,
PCT Pub. No. WO2021/006430, PCT Pub. Date Jan. 14, 2021.
Claims priority of application No. 10-2019-0081067 (KR), filed on Jul. 5, 2019.
Prior Publication US 2022/0267520 A1, Aug. 25, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C08G 69/26 (2006.01); C08G 73/10 (2006.01); C09D 179/08 (2006.01); H01B 3/30 (2006.01)
CPC C08G 69/265 (2013.01) [C08G 73/1085 (2013.01); C09D 179/08 (2013.01); H01B 3/306 (2013.01)] 12 Claims
 
1. A polyamic acid composition comprising a non-fluorine-based diamine monomer and a non-fluorine-based dianhydride monomer as polymerization units, and comprising at least one of a fluorine-based diamine monomer and a fluorine-based dianhydride monomer as polymerization units, wherein
the polyamic acid composition has a permittivity of 3.0 or less after curing, softening resistance of 500° C. or more, a dielectric breakdown voltage of 1 0 kV or more, and tanδ of 260° C. or more.