US 12,479,938 B2
Polymeric resin for dielectric applications
Colin Hayes, Hudson, MA (US); Michael K. Gallagher, Hopkinton, MA (US); and Gregory Prokopowicz, Worcester, MA (US)
Assigned to ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD., (KR)
Filed by Rohm and Haas Electronic Materials LLC, Marlborough, MA (US)
Filed on Apr. 28, 2022, as Appl. No. 17/731,605.
Prior Publication US 2023/0348635 A1, Nov. 2, 2023
Int. Cl. C08F 12/12 (2006.01); C08F 2/06 (2006.01); C08F 12/32 (2006.01); C08F 212/12 (2006.01); C08F 212/32 (2006.01); C08G 8/32 (2006.01); H01B 3/18 (2006.01)
CPC C08F 212/32 (2013.01) [C08F 2/06 (2013.01); C08F 12/12 (2013.01); C08F 12/32 (2013.01); C08F 212/12 (2013.01); C08G 8/32 (2013.01); H01B 3/18 (2013.01)] 7 Claims
 
1. A resin composition from a mixture comprising:
(a) 60-90 weight % of at least one thermosetting resin based on total non-volatiles; and
(b) 10-40 weight % of at least one aryl ether resin based on total non-volatiles, wherein the at least one thermosetting resin is an arylcyclobutene resin, and the at least one aryl ether resin is selected from the group consisting of Formula (B1)-Formula (B6)

OG Complex Work Unit Chemistry
where n=1 to 10.