US 12,479,062 B2
Determining substrate orientation with acoustic signals
Nicholas A. Wiswell, Sunnyvale, CA (US); Benjamin Cherian, San Jose, CA (US); Jun Qian, Sunnyvale, CA (US); and Thomas H. Osterheld, Mountain View, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Oct. 10, 2022, as Appl. No. 17/963,142.
Claims priority of provisional application 63/349,020, filed on Jun. 3, 2022.
Prior Publication US 2023/0390884 A1, Dec. 7, 2023
Int. Cl. B24B 37/04 (2012.01); B24B 37/005 (2012.01); B24B 49/00 (2012.01)
CPC B24B 37/005 (2013.01) [B24B 37/042 (2013.01); B24B 49/003 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A chemical mechanical polishing apparatus, comprising:
a platen to support a polishing pad;
a carrier head to hold a surface of a substrate against the polishing pad;
a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate;
an in-situ acoustic monitoring system comprising an acoustic sensor that receives acoustic signals from the surface of the substrate; and
a controller configured to determine an angular orientation of the substrate based on received acoustic signals from the in-situ acoustic monitoring system.