US 12,479,049 B2
System and method to measure and calibrate laser processing machine using low-power beam profiler
Danny Chan, Berlin (DE)
Assigned to II-VI DELAWARE, INC., Wilmington, DE (US)
Filed by II-VI Delaware, Inc, Wilmington, DE (US)
Filed on Oct. 26, 2021, as Appl. No. 17/452,320.
Prior Publication US 2023/0130740 A1, Apr. 27, 2023
Int. Cl. B23K 26/70 (2014.01); B23K 26/04 (2014.01); B23K 26/06 (2014.01)
CPC B23K 26/705 (2015.10) [B23K 26/043 (2013.01); B23K 26/048 (2013.01); B23K 26/0648 (2013.01); B23K 26/707 (2015.10)] 23 Claims
OG exemplary drawing
 
1. An apparatus used for calibrating a laser processing machine that has a laser source, a laser head, at least one optical component associated with the laser head, and machine actuators that include at least one device actuator configured to position the laser head and at least one head actuator configured to adjust the at least one optical component, the apparatus comprising:
an imaging sensor configured to image an optical beam of the laser source from the laser head; and
a controller in operable communication with the imaging sensor and with at least one of the machine actuators, the controller being configured to:
control output of the optical beam from the laser head;
control the at least one machine actuator to position the laser head and/or the at least one optical component at a plurality of measurement positions relative to the imaging sensor;
obtain a plurality of images of the optical beam at the plurality of measurement positions from the imaging sensor;
measure at least one offset of the at least one optical component of the laser head based on the obtained images; and
output at least one adjustment of the laser processing machine corrective of the at least one offset.