US 12,478,245 B2
Endoscope module and modular endoscopic device including the same
Byung Sik Cheon, Daejeon (KR); and Dong Soo Kwon, Daejeon (KR)
Assigned to ROEN Surgical, Inc., Daejeon (KR)
Appl. No. 17/594,280
Filed by ROEN Surgical, Inc., Daejeon (KR)
PCT Filed Aug. 29, 2019, PCT No. PCT/KR2019/011049
§ 371(c)(1), (2) Date Oct. 8, 2021,
PCT Pub. No. WO2020/209451, PCT Pub. Date Oct. 15, 2020.
Claims priority of application No. 10-2019-0042087 (KR), filed on Apr. 10, 2019.
Prior Publication US 2022/0160212 A1, May 26, 2022
Int. Cl. A61B 1/00 (2006.01); A61B 1/005 (2006.01); A61B 1/05 (2006.01)
CPC A61B 1/00105 (2013.01) [A61B 1/00135 (2013.01); A61B 1/0057 (2013.01); A61B 1/05 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A modular endoscopic device comprising:
a base portion having a top, outer mounting surface onto which a camera module and a surgical instrument module are mounted, wherein the camera module includes a camera housing extending upward from the mounting surface and a camera tube and wherein the surgical instrument module includes a surgical instrument housing extending upward from the mounting surface and a surgical instrument tube;
a driver provided in the base portion beneath the mounting surface; and
an endoscope module including an endoscope housing with a lower surface, an insertion tube including a bendable bending portion and connected to the endoscope housing to be inserted into a body of a subject, and a bending wire configured to transfer a force to bend the bending portion,
wherein the lower surface of the endoscope module is detachably attachable to the mounting surface of the base portion distal to the camera housing and the surgical instrument housing such that, when the lower surface engages with the mounting surface, the endoscope housing extends upward from the mounting surface, and wherein the camera tube runs above the mounting surface from the camera housing to the endoscope module and the surgical instrument tube runs above the mounting surface from the surgical instrument housing to the endoscope module, and
when the endoscope module is attached to the base portion, the driver is configured to transfer power to the bending wire, and
when the endoscope module is detached from the base portion, the driver is configured not to transfer power to the bending wire.