US 12,150,355 B2
Display device including side terminal disposed along an inclined side surface thereof, and method of manufacturing the same
Seung-Soo Ryu, Hwaseong-si (KR); Sanghyeon Song, Seoul (KR); and Donghyun Lee, Asan-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed on Apr. 24, 2023, as Appl. No. 18/305,816.
Application 18/305,816 is a division of application No. 16/944,524, filed on Jul. 31, 2020, granted, now 11,678,533.
Claims priority of application No. 10-2019-0108530 (KR), filed on Sep. 3, 2019.
Prior Publication US 2023/0255073 A1, Aug. 10, 2023
Int. Cl. H10K 59/131 (2023.01); H10K 50/84 (2023.01); H10K 59/12 (2023.01); H10K 71/00 (2023.01)
CPC H10K 59/131 (2023.02) [H10K 50/841 (2023.02); H10K 71/00 (2023.02); H10K 59/1201 (2023.02)] 8 Claims
OG exemplary drawing
 
1. A method of manufacturing a display device, the method comprising:
preparing an array substrate including a pixel array disposed on a base substrate, a transfer wiring electrically connected to the pixel array and a conductive pattern electrically connected to the transfer wiring;
removing a portion of the array substrate to form an inclined side surface and to form a side terminal from the conductive pattern, the side terminal being exposed at the inclined side surface; and
forming a conductive connection pad including a first portion disposed on the side terminal and a second portion disposed on a lower surface of the array substrate,
wherein the second portion of the conductive connection pad contacts the lower surface of the array substrate,
wherein forming the conductive connection pad comprises:
disposing a mask under the array substrate, the mask having an opening exposing at least a portion of the inclined side surface and the lower surface of the array substrate;
forming a metal layer on the inclined side surface and the lower surface of the array substrate using the mask as a deposition mask; and
patterning the metal layer.