CPC H10K 59/131 (2023.02) [H05K 1/189 (2013.01); H05K 2201/10128 (2013.01); H10K 59/1201 (2023.02)] | 19 Claims |
1. A chip-on-film bonding structure, comprising:
a chip on film comprising a first pin, wherein the first pin comprises a first end and a second end that are arranged to be opposite to each other; and
a flexible circuit board comprising a second pin connected to the first pin, wherein the second pin comprises a third end and a fourth end that are arranged to be opposite to each other,
wherein the first end of the first pin and the third end of the second pin overlap with each other to form a first active contact region, and
the second end of the first pin and the fourth end of the second pin respectively extend outward from two opposite sides of the first active contact region, to form a first exposed region at the second end of the first pin and to form a second exposed region at the fourth end of the second pin,
wherein the first exposed region has a first length in an extending direction from the first end to the second end; the second exposed region has a second length in an extending direction from the third end to the fourth end; and both the first length and the second length are less than 0.3 mm.
|