US 12,150,284 B2
Multi-dimensional column-based heat dissipation features for datacenter cooling systems
Susheela Nanjunda Rao Narasimhan, Fremont, CA (US); Mohammad Amin Nabian, Sunnyvale, CA (US); Oliver Hennigh, Everett, WA (US); Sanjay Choudhry, Sunnyvale, CA (US); and Kaustubh Mahesh Tangsali, Sunnyvale, CA (US)
Assigned to Nvidia Corporation, Santa Clara, CA (US)
Filed by Nvidia Corporation, Santa Clara, CA (US)
Filed on Mar. 25, 2022, as Appl. No. 17/704,678.
Prior Publication US 2023/0309272 A1, Sep. 28, 2023
Int. Cl. F24H 3/00 (2022.01); H05K 7/20 (2006.01)
CPC H05K 7/20827 (2013.01) [H05K 7/20409 (2013.01); H05K 7/20836 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A datacenter cooling system, comprising:
a plurality of multi-dimensional column-based heat dissipation features for cooling by a cooling media flowing there through, an individual heat dissipation column comprising a first dimension and a second dimension, the first dimension to be normal relative to an axial flow path of the cooling media and the second dimension to be parallel or offset from parallel relative to the axial flow path, the second dimension to be more than the first dimension, wherein the multi-dimensional column-based heat dissipation features comprise at least one curved surface at a front or a rear of the first dimension or the second dimension.