US 12,150,278 B2
Heat dissipating apparatus for electronic elements
Kyo Sung Ji, Hwaseong-si (KR); Bae Mook Jeong, Suwon-si (KR); and In Hwa Choi, Yongin-si (KR)
Assigned to KMW INC., Hwaseong-si (KR)
Filed by KMW INC., Hwaseong-si (KR)
Filed on Aug. 5, 2022, as Appl. No. 17/881,653.
Application 17/881,653 is a continuation of application No. PCT/KR2021/001451, filed on Feb. 4, 2021.
Claims priority of application No. 10-2020-0015080 (KR), filed on Feb. 7, 2020; and application No. 10-2021-0015840 (KR), filed on Feb. 4, 2021.
Prior Publication US 2022/0377941 A1, Nov. 24, 2022
Int. Cl. H05K 7/20 (2006.01); H01Q 1/02 (2006.01); H05K 7/14 (2006.01)
CPC H05K 7/20327 (2013.01) [H01Q 1/02 (2013.01); H05K 7/1427 (2013.01); H05K 7/2039 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A cooling apparatus for electronic elements, comprising:
a heat dissipating housing having an internal space formed therein;
a shield case made of a thermally conductive material, disposed in the heat dissipating housing, and partitions the internal space into a first chamber which is a vacuum space filled with a refrigerant and a second chamber which is a non-vacuum space; and
a printed circuit board disposed in the shield case and provided with a heating element,
wherein the shield case evaporates the refrigerant using sensible heat transferred from the heating element to the shield case and latent heat transferred from the shield case to the first chamber,
wherein:
the heat dissipating housing includes a housing body and a rear cover which covers an open rear surface of the housing body;
an insertion part is formed to protrude forward from a front surface of the rear cover;
the first chamber is an outer space of the insertion part of the internal space of the housing body; and
the second chamber is an internal space of the insertion part.