| CPC H05K 7/203 (2013.01) [H05K 7/20318 (2013.01); H05K 7/20327 (2013.01); H05K 7/20818 (2013.01)] | 10 Claims |
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1. An immersion cooling system for a server cabinet, comprising:
a plurality of server boxes, each having a cooling liquid and comprising an electronic device immersed in the cooling liquid, wherein the electronic device of at least one of the plurality of server boxes generates a thermal energy during the operation of the electronic device so that a part of the cooling liquid evaporates into a hot vapor;
a cooling tank connected to the plurality of server boxes, and comprising:
a condenser connected to a vent hole of each of the plurality of server boxes, wherein the condenser condenses the hot vapor from the server box to form the cooling liquid; and
a storage part connected to the condenser, wherein the storage part storages the cooling liquid from the condenser; and
a plurality of liquid connecting pipes, each having a first end connected to a bottom portion of the storage part and a second end connected to a bottom portion of the corresponding server box;
wherein the cooling liquid in the storage part flows into each of the plurality of server boxes through each of the plurality of liquid connecting pipes,
wherein the cooling liquid in the storage part and the cooling liquid in each of the plurality of server boxes are maintained in a same liquid level,
wherein the condenser comprises a first condensing pipe, a second condensing pipe, a plurality of copper pipes, a hot water output pipe and a cooling water input pipe, each of the plurality of copper pipes has a first end and a second end, and each of the plurality of copper pipes is bent and wound, the first condensing pipe is connected to the first end of each of the plurality of copper pipes, and the second condensing pipe is connected to the second end of each of the plurality of copper pipes, and the first condensing pipe and the second condensing pipe are connected to the hot water output pipe and the cooling water input pipe, respectively,
wherein cooling water is injected into the second condensing pipe through the cooling water input pipe, the cooling water flows into the plurality of copper pipes through the second condensing pipe, an outer wall of the copper pipe is cooled down by the flowing cooling water, the hot vapor from the server box condenses into the cooling liquid when the hot vapor contacts the outer wall of the copper pipe, wherein a heat energy lost from the hot vapor during the condensation process is conducted inside of the copper pipe to heat up the cooling water and turn it into hot water, and the hot water is vented through the first condensing pipe and the hot water output pipe.
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