US 12,150,271 B2
Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device
Telesphor Kamgaing, Chandler, AZ (US); Johanna M. Swan, Scottsdale, AZ (US); Georgios Dogiamis, Chandler, AZ (US); Henning Braunisch, Phoenix, AZ (US); Adel A. Elsherbini, Chandler, AZ (US); Aleksandar Aleksov, Chandler, AZ (US); and Richard Dischler, Bolton, MA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 8, 2023, as Appl. No. 18/331,474.
Application 18/331,474 is a continuation of application No. 16/402,055, filed on May 2, 2019, granted, now 11,716,826.
Claims priority of application No. 20190100149 (GR), filed on Mar. 29, 2019.
Prior Publication US 2023/0320021 A1, Oct. 5, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/14 (2006.01); H01P 3/16 (2006.01); H01P 5/08 (2006.01); H01P 5/12 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01); H01L 25/18 (2023.01); H05K 1/18 (2006.01)
CPC H05K 7/1489 (2013.01) [H01P 3/16 (2013.01); H01P 5/087 (2013.01); H01P 5/12 (2013.01); H05K 1/0243 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 25/18 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/16225 (2013.01); H05K 1/181 (2013.01); H05K 2201/10356 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A computing device, comprising:
a chassis;
a first server blade coupled with the chassis at a first vertical location, wherein the first server blade includes a first microelectronic package and a first waveguide communicatively coupled with the first microelectronic package;
a second server blade coupled with the chassis at a second vertical location below the first vertical location, wherein the second server blade includes a second microelectronic package and a second waveguide communicatively coupled with the second microelectronic package; and
a third waveguide communicatively coupled to the first waveguide and the second waveguide, wherein the first microelectronic package is communicatively coupled with a first end of the third waveguide by the first waveguide, the second microelectronic package is communicatively coupled with a second end of the third waveguide by the second waveguide, and at least a portion of the third waveguide is oriented vertically between the first server blade and the second server blade.