US 12,150,264 B1
Electronic device including clad components
Abhijeet Misra, Mountain View, CA (US); Hoishun Li, Sunnyvale, CA (US); Todd S. Mintz, San Jose, CA (US); Isabel Yang, San Jose, CA (US); James A. Curran, Sunnyvale, CA (US); Lei Gao, Shanghai (CN); Chuan Liu, Honghu (CN); and Yu Yan, Shanghai (CN)
Assigned to APPLE INC., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Apr. 30, 2024, as Appl. No. 18/651,139.
Application 18/651,139 is a continuation of application No. 18/461,458, filed on Sep. 5, 2023.
Claims priority of provisional application 63/500,512, filed on May 5, 2023.
Int. Cl. G06F 1/16 (2006.01); H05K 5/00 (2006.01); H05K 5/04 (2006.01)
CPC H05K 5/04 (2013.01) [G06F 1/1656 (2013.01); H05K 5/0086 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A housing for an electronic device, comprising:
an exterior titanium portion;
an interior aluminum joined to the exterior titanium portion; and
an intermetallic interface disposed between the exterior titanium portion and the interior aluminum, the intermetallic interface having a thickness disposed between the interior metal and the exterior titanium portion.