US 12,150,252 B2
Electromagnetic compatibility contact between metal castings and printed circuit boards
Jianing Chen, Northville, MI (US); Jon Curry, Commerce Township, MI (US); and David Jia, Canton, MI (US)
Assigned to Harman International Industries, Incorporated, Stamford, CT (US)
Filed by Harman International Industries, Incorporated, Stamford, CT (US)
Filed on Mar. 31, 2023, as Appl. No. 18/193,823.
Application 18/193,823 is a division of application No. 17/463,832, filed on Sep. 1, 2021, granted, now 11,641,718.
Prior Publication US 2023/0240021 A1, Jul. 27, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/02 (2006.01); H01L 23/367 (2006.01); H05K 3/34 (2006.01); H05K 5/04 (2006.01); H05K 5/06 (2006.01); H05K 5/00 (2006.01)
CPC H05K 3/3457 (2013.01) [H05K 1/0215 (2013.01); H05K 5/0008 (2013.01)] 5 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a plurality of circuit boards, each circuit board has a first predetermined pattern of solder bumps facilitating a ground connection for the electronic device;
a plurality of enclosure members that enclose the plurality of circuit boards and create space between each enclosure member and each circuit board; and
a first bead protruding from a perimeter edge of each enclosure member, the bead contacts the first predetermined pattern of solder bumps on the circuit board to complete a ground connection.