US 12,150,251 B2
Electromagnetic compatibility contact between metal castings and printed circuit boards
Jianing Chen, Northville, MI (US); Jon Curry, Commerce Township, MI (US); and David Jia, Canton, MI (US)
Assigned to Harman International Industries, Incorporated, Stamford, CT (US)
Filed by Harman International Industries, Incorporated, Stamford, CT (US)
Filed on Mar. 31, 2023, as Appl. No. 18/193,803.
Application 18/193,803 is a division of application No. 17/463,832, filed on Sep. 1, 2021, granted, now 11,641,718.
Prior Publication US 2023/0247773 A1, Aug. 3, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/02 (2006.01); H01L 23/367 (2006.01); H05K 3/34 (2006.01); H05K 5/04 (2006.01); H05K 5/06 (2006.01); H05K 5/00 (2006.01)
CPC H05K 3/3457 (2013.01) [H05K 1/0215 (2013.01); H05K 5/0008 (2013.01)] 5 Claims
OG exemplary drawing
 
1. An electronic device comprising:
at least one circuit board having a predetermined pattern of solder bumps facilitating a ground connection;
first and second enclosure members, each having a surface facing the at least one circuit board sandwiching the circuit board between the surfaces; and
a bead protruding from the surface of the enclosure member facing the at least one circuit board, the bead contacts the predetermined pattern of solder bumps.