US 12,150,243 B2
Package assembly
Yi Cheng, New Taipei (TW); Wei-Ching Chang, New Taipei (TW); Kang-Bin Mah, New Taipei (TW); Li-Wei Chen, New Taipei (TW); Zi-Ping Wu, New Taipei (TW); and Ting-Yu Pai, New Taipei (TW)
Assigned to Wiwynn Corporation, New Taipei (TW)
Filed by Wiwynn Corporation, New Taipei (TW)
Filed on Nov. 21, 2022, as Appl. No. 17/990,748.
Claims priority of provisional application 63/356,041, filed on Jun. 28, 2022.
Claims priority of provisional application 63/287,528, filed on Dec. 9, 2021.
Prior Publication US 2023/0189434 A1, Jun. 15, 2023
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/0272 (2013.01) [H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 2201/064 (2013.01); H05K 2201/10977 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A package assembly comprising:
a substrate;
an electronic component disposed on the substrate;
a cover disposed on the substrate, the cover comprising a top portion, a first side portion, a second side portion and a heat dissipation space, the first side portion and the second side portion extending from opposite sides of the top portion and being connected to the substrate, the heat dissipation space being formed within the top portion, the first side portion and the second side portion, a chamber being formed between the top portion, the first side portion, the second side portion and the substrate, the electronic component being located within the chamber;
a first tube connected to the first side portion and communicating with the heat dissipation space;
a second tube connected to the second side portion and communicating with the heat dissipation space;
a third tube connected to the first side portion and communicating with the chamber;
a fourth tube connected to the second side portion and communicating with the chamber;
a first manifold connected to the first tube and the third tube;
a second manifold connected to the second tube and the fourth tube; and
a pump connected to the first manifold, the pump driving a cooling liquid to flow into the heat dissipation space and the chamber through the first manifold, the first tube and the third tube, the cooling liquid flowing out of the heat dissipation space and the chamber through the second tube, the fourth tube and the second manifold.