US 12,149,857 B2
Solid-state imaging device and electronic apparatus
Luonghung Asakura, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/310,149
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Jan. 16, 2020, PCT No. PCT/JP2020/001164
§ 371(c)(1), (2) Date Jul. 21, 2021,
PCT Pub. No. WO2020/158400, PCT Pub. Date Aug. 6, 2020.
Claims priority of application No. 2019-013775 (JP), filed on Jan. 30, 2019.
Prior Publication US 2022/0094874 A1, Mar. 24, 2022
Int. Cl. H04N 25/79 (2023.01); H04N 17/00 (2006.01); H04N 25/75 (2023.01)
CPC H04N 25/79 (2023.01) [H04N 17/00 (2013.01); H04N 25/75 (2023.01)] 15 Claims
OG exemplary drawing
 
1. A solid-state imaging device, comprising:
a pixel array unit that includes a plurality of pixels two-dimensionally arranged in a matrix;
one redundant wiring for n number of signal lines, wherein the n number of signal lines transmit a pixel signal from the plurality of pixels; and
a plurality of redundant switches, wherein
a first redundant switch of the plurality of redundant switches is configured to connect a first signal line of the n number of signal lines to the one redundant wiring, and
a second redundant switch of the plurality of redundant switches is configured to connect a second signal line of the n number of signal lines to the one redundant wiring.