US 12,149,843 B2
Imaging device and electronic equipment
Eriko Kato, Kanagawa (JP); and Mamoru Sato, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/756,238
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Oct. 28, 2020, PCT No. PCT/JP2020/040431
§ 371(c)(1), (2) Date May 19, 2022,
PCT Pub. No. WO2021/106478, PCT Pub. Date Jun. 3, 2021.
Claims priority of application No. 2019-216280 (JP), filed on Nov. 29, 2019; and application No. 2020-162862 (JP), filed on Sep. 29, 2020.
Prior Publication US 2022/0417461 A1, Dec. 29, 2022
Int. Cl. H04N 25/63 (2023.01); H04N 25/78 (2023.01); H04N 25/79 (2023.01)
CPC H04N 25/63 (2023.01) [H04N 25/78 (2023.01); H04N 25/79 (2023.01)] 27 Claims
OG exemplary drawing
 
1. An imaging device in which, in a pixel array section in which a selection pixel where signal readout is performed and a reference pixel where signal readout is not performed are arranged, an amplification transistor of the selection pixel and an amplification transistor of the reference pixel each source electrode of which is connected in common to a common wire are connected with a constant current source via the common wire to form a differential amplification circuit, the imaging device comprising:
a bypass control section which selectively establishes connection between the constant current source and a differential output node of the differential amplification circuit, and limits a voltage of the differential output node to a predetermined voltage by causing a bypass current to flow between the constant current source and the differential output node; and
a current path for bypass current that supplies the bypass current to the constant current source through the pixel array section.