US 12,149,811 B2
Camera module having a soldering portion coupling a driving device and a circuit board
Jong Ho Chung, Seoul (KR); and Sung Il Lee, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Filed by LG INNOTEK CO., LTD., Seoul (KR)
Filed on Apr. 26, 2023, as Appl. No. 18/307,539.
Application 18/307,539 is a continuation of application No. 17/653,985, filed on Mar. 8, 2022, granted, now 11,671,690.
Application 17/653,985 is a continuation of application No. 17/172,391, filed on Feb. 10, 2021, granted, now 11,303,787, issued on Apr. 12, 2022.
Application 17/172,391 is a continuation of application No. 16/531,661, filed on Aug. 5, 2019, granted, now 10,958,813, issued on Mar. 23, 2021.
Application 16/531,661 is a continuation of application No. 15/772,451, granted, now 10,419,650, issued on Sep. 17, 2019, previously published as PCT/KR2016/012504, filed on Nov. 2, 2016.
Claims priority of application No. 10-2015-0155557 (KR), filed on Nov. 6, 2015; and application No. 10-2015-0169957 (KR), filed on Dec. 1, 2015.
Prior Publication US 2024/0080540 A1, Mar. 7, 2024
Int. Cl. H04N 23/55 (2023.01); G02B 7/00 (2021.01); G02B 7/08 (2021.01); G02B 7/09 (2021.01); G02B 27/64 (2006.01); H04N 23/54 (2023.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/14 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01)
CPC H04N 23/55 (2023.01) [G02B 7/006 (2013.01); G02B 7/08 (2013.01); G02B 7/09 (2013.01); G02B 27/646 (2013.01); H04N 23/54 (2023.01); H05K 3/305 (2013.01); H05K 1/0281 (2013.01); H05K 1/0306 (2013.01); H05K 1/147 (2013.01); H05K 3/341 (2013.01); H05K 2201/0175 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A camera module, comprising:
a first circuit board;
an image sensor disposed on the first circuit board;
a lens barrel disposed opposite to the image sensor via a filter in a first direction in parallel to an optical axis;
a second circuit board comprising a first part overlapped with the first circuit board in the first direction and coupled to the first circuit board and a second part not overlapped with the first circuit board in the first direction; and
a first reinforcement portion comprising a first portion disposed on the first part of the second circuit board and a second portion disposed on the second part of the second circuit board.